Global semiconductor equipment billings hit $135.1 billion in 2025 — up 15% YoY from $117.1 billion — according to SEMI’s Worldwide Semiconductor Equipment Market Statistics report. Asia dominated spending, with China, Taiwan, and Korea accounting for 79% of the global total. Test equipment billings surged 55%, driven by AI and HBM demand, while advanced packaging equipment rose 21%. Taiwan’s investment soared 90% to $31.5 billion; Korea grew 26% to $25.8 billion; China held steady at $49.3 billion. Europe contracted 41% to $2.9 billion, reflecting persistent softness in automotive and industrial sectors.
According to www.dqindia.com, global semiconductor equipment billings reached $135.1 billion in 2025 — a 15% year-over-year increase from $117.1 billion in 2024 — driven by sustained investment in advanced logic, memory, and AI-related capacity expansion, as reported by SEMI, the industry association representing the global electronics design and manufacturing supply chain.
Front-End and Back-End Equipment Growth
The front-end semiconductor equipment market posted solid growth in 2025: wafer processing equipment sales rose 12%, while other front-end segments increased 13%. This expansion was fueled primarily by continued investment in leading-edge logic and memory capacity, supported by AI-related demand and ongoing node and technology migrations.
The back-end equipment segment also recorded strong growth: test equipment billings surged 55% year-over-year, reflecting heightened performance requirements and test intensity for AI devices and high-bandwidth memory (HBM); assembly and packaging equipment sales rose 21% as adoption of advanced packaging technologies expanded.
Regional Spending Shifts
Regionally, semiconductor equipment spending remained heavily concentrated in Asia in 2025. China, Taiwan, and Korea together accounted for 79% of the global market — up from 74% in 2024.
- China’s equipment spending remained near record levels at $49.3 billion, down just 0.5% year-over-year, as domestic chipmakers continued investing in mature nodes and select advanced capacity.
- Taiwan’s spending rose 90% year-over-year to a record $31.5 billion, reflecting AI- and HPC-driven capacity expansion.
- Korea increased 26% to $25.8 billion, supported by strong investment in HBM and DRAM.
- Japan grew 22% to $9.5 billion, backed by continued investment in domestic advanced-node manufacturing.
- Europe declined 41% to $2.9 billion — marking a second consecutive year of contraction amid weakness in automotive and industrial demand.
- North America fell 20% to $10.9 billion as spending moderated following earlier capacity expansion.
- The rest of the world increased 25% to $5.2 billion, reflecting expanding activity in emerging semiconductor production markets.
“Record semiconductor equipment billings of $135 billion in 2025 underscore the scale and urgency of the industry’s buildout as AI accelerates demand for leading-edge logic, advanced memory and high-bandwidth architectures.” — Ajit Manocha, SEMI President and CEO
Source: www.dqindia.com
Compiled from international media by the SCI.AI editorial team.
